Buy eSun ABS+HS Filament

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eSun ABS+HS Filament

The eSun ABS+HS Filament is a modified ABS filament for FDM and FFF 3D printing that has been specially optimized for high print speeds. Compared to standard ABS, it offers lower shrinkage, stronger layer adhesion, and a reduced tendency to warp and crack. At the same time, the low-VOC formulation ensures a less odorous printing process and more pleasant handling.

High-Speed ABS with Improved Print Stability

ABS+HS was developed for fast and reliable 3D printing processes. The material maintains its performance even at higher print speeds and enables stable print results with good dimensional accuracy. This makes the filament particularly suitable for efficient manufacturing processes, functional prototypes, technical components, and small-batch production of components.

Lower shrinkage and strong interlayer adhesion

Compared to conventional ABS, eSun ABS+HS exhibits a lower shrinkage rate and improved interlayer adhesion. This reduces the risk of warping, cracks, and delamination during the printing process. This material optimization ensures more reliable results, particularly for larger parts, technical geometries, and functional models.

Lower-odor printing thanks to low-VOC formulation

The low-VOC composition reduces volatile organic compounds during printing and results in less odor. This makes processing more pleasant than with many traditional ABS materials. For professional 3D printing applications where ABS properties are desired, ABS+HS offers a more convenient and controllable material solution.

Acetone smoothing for high-quality surfaces

Printed parts made from eSun ABS+HS can be smoothed with acetone. This reduces visible layer lines and significantly improves surface quality. This property is particularly advantageous for visible enclosures, toys, design models, molds, and parts with high aesthetic requirements.

      Advantages at a Glance
      
High-speed optimized: Developed for fast FDM and FFF 3D printing processes.

Low shrinkage: Reduces warping and cracking compared to standard ABS.

Strong layer adhesion: Improved interlayer adhesion for durable components.

Low odor: Low-VOC formulation for a more pleasant printing experience.

Heat-resistant: Suitable for technical parts subject to thermal stress.

Acetone-smoothing: Post-processing to reduce visible layer lines is possible.

Tough and high-performance: Robust material performance for functional applications.

Technisches 3D-Druck-Bauteil aus eSun ABS+HS Filament mit glatter Oberfläche

High-Speed ABS-Filament für funktionale 3D-Druck-Anwendungen

For fast ABS prints with less warping

eSun ABS+HS is a technical 3D filament for users who want to combine typical ABS properties with improved print stability and higher processing speeds. The filament is suitable for robust parts that need to be tough, heat-resistant, and post-processable. Thanks to its combination of low shrinkage, strong layer adhesion, and high-speed optimization, ABS+HS offers a reliable solution for productive 3D printing projects.

Typical Applications

The filament is suitable for mechanical engineering, mold making, toys, automotive applications, electronic devices, technical enclosures, fixtures, mounts, functional prototypes, and durable everyday components. Wherever 3D-printed parts need to be tough, heat-resistant, less prone to warping, and capable of surface finishing, eSun ABS+HS provides a robust material foundation.

Item information	Value

      
            Technical Specifications
          
            Feature
            Value
          
            Density (g/cm³)
            1.04
          
            Melt Flow Index
            6 (220 °C/10 kg)
          
            Heat distortion temperature (°C, 0.45 MPa)
            89
          
            Tensile strength (MPa) (XY)
            41.64
          
            Tensile strength (MPa) (Z)
            27.08
          
            Elongation at break (%) (XY)
            5.14
          
            Elongation at break (%) (Z)
            3.4
          
            Flexural strength (MPa) (XY)
            46
          
            Flexural strength (MPa) (Z)
            44.5
          
            Modulus of bending (MPa) (XY)
            2349.32
          
            Modulus of flexural elasticity (MPa) (Z)
            1934.88
          
            IZOD impact strength (kJ/m²) (XY)
            25.94
          
            IZOD impact strength (kJ/m²) (Z)
            3.14
          
            Extruder temperature (°C)
            230–270 °C
          
            Bed temperature (°C)
            95–110 °C
          
            Fan speed (%)
            0%
          
            Print speed (mm/s)
            50–300 mm/s
          
            Heated bed
            Required
          
            Printing recommendation
            Print in a closed print chamber

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